okamoto wafer grinding machine

Wafer Backside Grinding - Okamoto Machine Tool Works,Ltd

For thin wafer, Grinding/Polishing/Detape fully automatic process by 1 machine. Feature ・The process from back grinding to wafer mounting continuously by fully automatic system, which enable to grind till 25um thickness.

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Okamoto晶圆研磨,晶圆减薄_Wafer Grinding_晶圆抛光,晶圆 ...

2021-12-7 · Wafer Grinding_晶圆研磨,晶圆减薄,晶圆抛光,晶圆背抛，SiC碳化硅晶圆减薄机，GaN氮化镓晶圆减薄机 致力于引进国外高端制造设备、精密检测仪器、先进生产材料为中国电子电器生产企业服务，以助于电子制造企业稳定提高产

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OKAMOTO GDM300 Wafer GrindingHAPOIN

2021-12-2 · OKAMOTO GDM300：. Model GDM300 grinder is a fully automatic continuous downfeed grinding machine with dual polishing stations for increased throughput. Wafers are handled through the machine by a 6-axis robot, and load/unload arms designed for 25 um capability. An optional edge trimming system is recommended for eliminating edge chipping for ...

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OKAMOTO GDM300晶圆抛光/晶圆背抛 上海衡鹏

2021-12-7 · Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind

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OKAMOTO GNX300B_Wafer GrindingHAPOIN

2021-12-2 · OKAMOTO GNX300B： Fully-automatic wafer grinder with down-feed grinding method and Robotics wafer handling. 8″ and 12″ grinder.Wafers are handled through the machine by a robot, and load/unload arms.

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Products - Okamoto Machine Tool Works,Ltd

Grinding machine, Semiconductor equipment, Gear and Casting only One for Total Abrasive Machine manufacturer in the World ... processing.Against this requirement based on over 50 years history of Surface grinder technology and have semiconductor wafer processing in polish technology. Introduce for total abrasive machine manufacturer OKAMOTO ...

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Okamoto Machine Tool Works,Ltd

[ Head Office ／ Annaka factory ] 2993 Gobara,Annaka,Gunma,379-0315 JAPAN. TEL:027-385-5800 FAX:027-385-5880

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Polishing Machine - Okamoto Machine Tool Works,Ltd

Feature. ・To correspond to 450mm wafer , it adopt new concept of machine design. ・ Polish stage has 3 platen.1st, 2nd, 3rd platen, 6 wafers polishing simultaneously. ・ Best solution for reclaim wafer and TSV wafer which require the large amount of polish removal. ・ SPP1200S is 1 table type manual polisher.

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Machines | 株式会社岡本工作機械製作所 機械から探す

NC Double Column Type Surface Grinding Machine. PSG-CH-iQ series. CNC Double Column Type Surface Grinding Machine. PSG-CHNC,CHVNC series. CNC Double Column Type Surface Grinding Machine PSG4025CHNC. CNC Double Column Type Surface Grinding Machine DCG8020NC. CNC Ultra Precision Double Column Type Surface Grinding Machine

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Okamoto Corporation

Double Column Series. Double Column Series. Rotary Series

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Used Okamoto Wafer Grinding for sale | Machinio

Okamoto VG502-MKII/8 and VG502 wafer grinding for sale. Find used equipment for semiconductor wafers grinding process on Machinio.

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Okamoto NC & CNC Grinding Machines | Surface, ID/OD ...

2021-8-3 · Always a Smooth Finish with Okamoto Grinding Machines. Established in 1926, the Okamoto Corporation has made a name as a market leader in the production of surface automatic and CNC grinding machines.Known in the industry as a Total Abrasive Process Machine manufacturer, Okamoto provides the most advanced grinding technology in the industry with

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Okamoto VG-502MKII8 Grinder - S3 Alliance

AXUS technology is specializing in remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spareparts. The Okamoto VG-502 is a fully-automatic, continuous in-feed grinding machine, designed to grind semiconductor raw materials such as silicon, carbide, ceramics, glass and other brittle materials ...

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Wafer Grinding HAPOIN

2021-12-2 · Machine has high-horsepower motor and extra rigid casting to compensate for maintaining tight tolerances. OKAMOTO GNX200B Fully Automatic wafer grinder with down-feed grinding method and Robotics wafer handling.

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OKAMOTO grinder VG502 MKII-8 wafer

OKAMOTO grinder VG502 MKII-8 wafer . Tweet. Related products. DISCO DFP8140 wafer polisher $ 0.00. Add to cart Show Details. Kebelco LEM-300C Wafer Edge Microscope $ 0.00. Add to cart Show Details. Tel P-12XL AUTOMATIC WAFER PROBER 12″ ...

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(QTY: 2) Okamoto GNX 300 Wafer Back Grinder

2020-2-4 · okamoto gnx 300 wafer back grinder #1 0ruh 3krwrv rq )roorzlqj 3djhv 7r rxu nqrzohgjh wkh lqirupdwlrq frqwdlqhg lq wklv gdwd vkhhw lv dffxudwh exw lw pd\ frqwdlq huuruv dqg zh gr qrw zduudqw wkh frpsohwhqhvv ru dffxudf\ ri wklv gdwd

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Okamoto GNX300 300mm wafer grinder - CSI Semi

Okamoto GNX300 300mm wafer grinder $ 0.00. Quantity. Add to cart. SKU: CSIB416 Categories: Back End Semiconductor, Grinding & Polishing. Description Product Description. Okamoto GNX300 300mm wafer grinder. paul@csisemi. Tweet. Related products. Accretech Tsk PG300RM $ 0.00. Add to cart Show Details.

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OKAMOTO MACHINE TOOL WORKS, LTD

2019-4-24 · OKAMOTO MACHINE TOOL WORKS, LTD SEMICONDUCTOR EQUIPMENT DIVISION. Confidential. Confidential. Confidential. Confidential. Confidential. Confidential 1. Crystal Growth 2. Single Crystal Ingot 3. Crystal Trimming and Diameter Grind 4. Flat/Notch Grinding 5. Wafer Slicing 10. Wafer Inspection 9. Polishing (DSP+CMP) 8. Wafer Etching 6.

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Polishing Machine - Okamoto Machine Tool Works,Ltd

Feature. ・To correspond to 450mm wafer , it adopt new concept of machine design. ・ Polish stage has 3 platen.1st, 2nd, 3rd platen, 6 wafers polishing simultaneously. ・ Best solution for reclaim wafer and TSV wafer which require the large amount of polish removal. ・ SPP1200S is 1 table type manual polisher.

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Okamoto Corporation

Double Column Series. Double Column Series. Rotary Series

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Fully Automated Wafer GrinderGNX200B

Okamoto Machine Tool Works 1 / 1 Fully Automated Wafer Grinder GNX200B 商品简述： Key Features Own Developed Downfeed Grinding + Index Wafer Transfer Mechanism Targeting Wafer Breakage ZERO High Accuracy, High Efficiency Come True on More ...

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Okamoto GNX 200 Grinder | Backgrinder

The Okamoto GNX 200 System is a fully automatic wafer grinder with down-feed grinding method and Robotics wafer handling. The machine can grind semiconductor material such as Si, GaAs and GaP, and can grind electronic

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(QTY: 2) Okamoto GNX 300 Wafer Back Grinder

2020-2-4 · okamoto gnx 300 wafer back grinder #1 0ruh 3krwrv rq )roorzlqj 3djhv 7r rxu nqrzohgjh wkh lqirupdwlrq frqwdlqhg lq wklv gdwd vkhhw lv dffxudwh exw lw pd\ frqwdlq huuruv dqg zh gr qrw zduudqw wkh frpsohwhqhvv ru dffxudf\ ri wklv gdwd

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Okamoto VG502-MKII 8 Grinder - SW Technology

Okamoto VG502-MKII 8 Grinder, Okamoto, VG502-MKII 8, Grinder, Okamoto VG502-MKII 8, Wafer Grinders

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OKAMOTO grinder VG502 MKII-8 wafer

OKAMOTO grinder VG502 MKII-8 wafer . Tweet. Related products. DISCO DFP8140 wafer polisher $ 0.00. Add to cart Show Details. Kebelco LEM-300C Wafer Edge Microscope $ 0.00. Add to cart Show Details. Tel P-12XL AUTOMATIC WAFER PROBER 12″ ...

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Okamoto GNX300 300mm wafer grinder - CSI Semi

Okamoto GNX300 300mm wafer grinder $ 0.00. Quantity. Add to cart. SKU: CSIB416 Categories: Back End Semiconductor, Grinding & Polishing. Description Product Description. Okamoto GNX300 300mm wafer grinder. paul@csisemi. Tweet. Related products. Accretech Tsk PG300RM $ 0.00. Add to cart Show Details.

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Okamoto VG 502 MKII 8 In-Feed Grinding Machine

2018-5-31 · Okamoto VG 502 MKII 8 In-Feed Grinding Machine - Automated high throughput two stage grinding - Angular control of grinding spindles for consistent uniformity and customized substrate profile - Capability for grinding 4” to 8” wafers, including custom shapes - Four wafer chucks on carousel allow for maximum throughput with the minimum

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OKAMOTO MACHINE TOOL WORKS, LTD

2019-4-24 · OKAMOTO MACHINE TOOL WORKS, LTD SEMICONDUCTOR EQUIPMENT DIVISION. Confidential. Confidential. Confidential. Confidential. Confidential. Confidential 1. Crystal Growth 2. Single Crystal Ingot 3. Crystal Trimming and Diameter Grind 4. Flat/Notch Grinding 5. Wafer Slicing 10. Wafer Inspection 9. Polishing (DSP+CMP) 8. Wafer Etching 6.

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UGM-5V CNC Features – Okamoto Corporation

UGM-5V CNC Series Universal Grinder. The UGM-5V Universal Grinder is ideal for high-precision grinding of large components. Robust design & construction and a powerful spindle motor easily process large, tough-to-grind parts. The added capability of angular grinding and an available automatic tool changer further enhance grinding capability and ...

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Machines – Okamoto Europe Machine Tools GmbH

Okamoto Machine Tool. Europe GmbH. Raiffeisenstr 7b. 63225, Langen/Germany. Tel.++49(0)6103-201 100. Fax++49(0)6103-201 1020. [email protected]: Geschäftsführer: Akihiro Takesada

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